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IBM CEO Statement on Landmark U.S. Semiconductor Funding in New York State
By Arvind Krishna | Chairman and Chief Executive Officer, IBM
September 20, 2023

Thanks to a $40M investment by the U.S. Department of Defense - the largest of 8 such awards nationwide - New York state’s legacy of semiconductor innovation is about to take a major step...

Thanks to a $40M investment by the U.S. Department of Defense - the largest of 8 such awards nationwide - New York state’s legacy of semiconductor innovation is about to take a major step forward, and IBM is proud to be playing a central role.

Our company is privileged to join a consortium including NY CREATES, industry partners, and leading research universities - Rensselaer Polytechnic Institute, the University at Albany, and Cornell University - selected to establish a DoD Microelectronics Commons Hub in the Empire State. These hubs are vital to the nation because they will strengthen the domestic chip workforce and boost R&D capabilities that will sustain U.S. leadership in semiconductor technology.

IBM is honored to do our part, and grateful to President Biden, Majority Leader Schumer, Governor Hochul, Secretary Austin, Secretary Raimondo and many other leaders committed to the future of America’s semiconductor industry.

Read More:

SCHUMER, HOCHUL ANNOUNCE NEW YORK RECEIVES FIRST-EVER DEPARTMENT OF DEFENSE MICROELECTRONICS COMMONS HUB, DELIVERING $40 MILLION FEDERAL INVESTMENT

Deputy Secretary of Defense Kathleen Hicks Announces $238M CHIPS and Science Act Award

 

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