In a world where technology is rapidly shaping the future, access to education and training programs is crucial to expanding opportunity. Recent research by UNESCO found that women make up only...
New findings from the IBM (NYSE: IBM) Institute for Business Value revealed that banking and financial markets (BFM) CEOs are facing workforce and culture and challenges as they act quickly to implement and scale generative AI across their organizations.
Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM, today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with the aim to further innovate in this space.
Intel is announcing that IBM has been named an Intel Foundry Accelerator Cloud Alliance partner, marking a step forward in the collaboration between our two companies to drive innovation and accelerate the deployment of advanced technologies.
Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors