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Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM, today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with the aim to further innovate in this space.

Intel is announcing that IBM has been named an Intel Foundry Accelerator Cloud Alliance partner, marking a step forward in the collaboration between our two companies to drive innovation and accelerate the deployment of advanced technologies.

IBM has signed an agreement to acquire SKYARCH NETWORKS INC. (“SKYARCH NETWORKS”), a Japan-based professional services company specializing in Amazon Web Services (AWS). The planned...

Today, at its annual THINK conference, IBM announced several new updates to its watsonx platform one year after its introduction, as well as upcoming data and automation capabilities designed to make artificial intelligence (AI) more open, cost effective, and flexible for businesses. During his opening keynote, CEO Arvind Krishna will share the company’s plans to invest in, build and contribute to the open-source AI community as a core part of IBM’s strategy.