Research and innovation news

IBM (NYSE: IBM) today unveiled the industry’s first published quantum‑centric supercomputing reference architecture, a new blueprint for integrating quantum computing into modern supercomputing environments. The architecture shows how quantum processors (QPUs) can work alongside GPUs and CPUs—across on‑premises systems, research centers, and the cloud—in order to tackle scientific challenges that no single computing approach can solve on its own.

IBM (NYSE: IBM) and Lam Research Corp. (NASDAQ: LRCX) today announced a collaboration aimed at developing new processes and materials to support sub-1nm logic scaling. Building on a long record of successful partnerships, the new agreement will focus on the joint development of novel materials, fabrication processes, and High-NA EUV lithography processes to advance IBM’s logic scaling roadmap.

An international team of scientists from IBM (NYSE: IBM), The University of Manchester, Oxford University, ETH Zurich, EPFL and the University of Regensburg have created and characterized a molecule unlike any previously known — one whose electrons travel through its structure in a corkscrew-like pattern that fundamentally alters its chemical behavior. Published today in Science, it is the first experimental observation of a half-Möbius electronic topology in a single molecule.

IBM (NYSE: IBM) and Cisco (NASDAQ: CSCO) announced an intention to collaborate on the groundwork for networked distributed quantum computing, to be realized as soon as the early 2030s. By combining IBM’s leadership in building useful quantum computers with Cisco’s quantum networking innovations, the companies plan to explore how to scale large-scale, fault-tolerant quantum computers beyond IBM’s ambitious roadmap. Additionally, they will work to solve fundamental challenges towards a quantum computing internet.

IBM (NYSE: IBM) and the University of Dayton today announced an agreement for the joint research and development of next-generation semiconductor technologies and materials. The collaboration aims to advance critical technologies for the age of AI including AI hardware, advanced packaging, and photonics.